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    ZL808-C

    Universal two-in-one, supporting braiding, piping two packaging IC burning/testing, marking and packaging conversion functions.

    External braiding system supports 8-32MM wide-band adjustable, convenient and fast. Braided piping supports interchangeable packaging.

    Taping can be equipped with dotting system, marking function on the chip surface to facilitate production management.

    It can be equipped with high-definition up and down CCD, automatic alignment of IC coordinates, automatic adjustment of X, Y and theta parameters, automatic correction of offset data.

    It can burn and test 1-32 chips at a time. One hour production capacity can reach 1300 + 200 UPH.

    Automatic alarm, abnormal condition or burning completion of the machine will automatically alarm reminder function. Special Receiving Zone for Bad Products

    Imported parts are used to ensure the service life and working stability of the equipment.

    The Chinese-English menu is displayed on the touch screen with a friendly user interface.

    It is suitable for the burning of many ICs and has a wide range of applications.


    Details

    This product is mainly used for testing/packaging conversion/identification of IC (integrated circuit)

    Testable items

    IC TYPE:MCU,FLASH,EMMC,NAND FLASH,EPROM,Wait...

    IC ENCAPSULATION:SOP,SSOP,TSSOP,MSOP,QFP,QFN,BGA,TQFP,LQFP,Wait...

    IC Packing:TubeTape


          technical specifications        

    Product model

    ZL808-C

    Machine architecture

    Longmen architecture

    Fastest speed

    1300±200UPH

      Accuracy of fetching and placing repetition

    +/-0.02mm

    Travel range

    X630mmY400mmZ50mm

    Machine size

    1400×800×1300mm

    weight

    130KG

    Soket Fetch and release mode

    Z axis Press/Cylinder press cap

    Suction nozzle

    Single suction nozzle rotatable

    Control system

    PLC

    Workstation

    0-32Workstation optional

    Power/Gas Source

    220V,50Hz/0.5MPa

    Suitable for IC packaging

    SOP/QFN/BGA/QFP,All encapsulated IC

    Suitable for programming

    AP80007500、Max Wiz、SOFI、Wait



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